Clamping in high-tech applications
The microstructures make it possible.
In the semiconductor industry and microelectronics, vacuum clamping techniques are in high demand, as the processing of wafers requires particularly sensitive handling. Our microstructure vacuum chucks enable absolutely "flat" clamping of the workpiece, thanks to the microporous surface. The vacuum achieves a high efficiency even with partially uncovered surfaces. This allows for workpieces of varying sizes to be fixed on the same plate. Since thin carrier films or wafers are not attracted through suction holes, grooves, etc., deformation is excluded. The microstructure vacuum chucks are characterized by full-surface suction, allowing films to be held completely flat.
The porous surface can be divided into separate areas and can thus be individually supplied with vacuum. The pressure drop within the structure makes the usual covering of free surfaces unnecessary. Equipped with appropriate controls, the plates can be heated or cooled up to 150 degrees Celsius.
Our range includes plate surfaces made from air-permeable materials such as sintered bronze, ceramics, or aluminum. Even black and fluorescent clamping surfaces or special plates for light transmission applications are available.
Impressions
Features
- Deformation of the workpieces is excluded
- Through-milling is possible with the use of a friction booster
- Modular designs for large clamping surfaces
- Custom-made solutions specific to the workpiece are possible
- METAPOR© plates available in different qualities
- Measurement and testing procedures
- Precision machining
- Thin-walled substrates (e.g., papers, films, circuit boards, wafers, PCB boards)
- Fine materials (e.g., optics)
- Flexible materials (e.g., rubber)
- Silicon wafer production
